Physical Characteristics

Construction
·Multi-layer surface-mount design with internal ground plane for EMI suppression
Dimensions(view)
·Total Width: 2.441inches (62 mm), including connectors
·Total Length: 3.346 inches (85 mm)
·Total height: 0.425 inches (10.8 mm)
·All mounting holes are plated through for chassis ground connection.
Refer to the drawings at the end of this document.
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Supply Voltage and Current
·+12 VDC, nominal(+11 VDC to +13 VDC)
·85 mA, typical at +12 VDC. Average power dissipation is 1 W, typical.
·Supply must be capable of sourcing 200 mA, minimum.
·Total noise and ripple requirement must be less than 100 mV (p-p) for frequency below 1 MHz, and less than 50 mV (p-p) for frequencies above 1 MHz.
Interface
· USB 1.1
Reliability
·MTBF greater than 200,000 hours per MIL-HDBK-217-F2 using the parts stress calculation method for ground benign environment with an ambient temperature of 40°C.
ESD
·Per EN 6100-4-2 : Contact discharge 4kV, air discharge 8kV.
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Touch Resolution
·4096x4096, size independent, 256 levels of Z axis(pressure)
Conversion Time
·Less than 16 ms per coordinate set (including transmitting time)
Humidity
·Operating: 10% to 90% RH, non-condensing
·Storage: 10% to 90% RH, non-condensing
Flammability
·The printed circuit board substrate is rated 94V0. All plastic components, such as headers and connectors, are also rated 94V0.
Environmental Temperature
·Operating: 0°C to 65°C
·Storage: -25°C to 85°C |